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Printed Electronics Insights: Smart Packaging & IoT is Oct. 12

OE-A, EPSRC, FlexTech host conference covering the field of printed electronics.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Together with EPSRC Centre for Innovative Manufacturing in Large-Area Electronics/University of Cambridge, OE-A is organizing “Printed Electronics Insights: Smart Packaging & IoT,” a day of presentations and a panel discussion co-sponsored by FlexTech.
 
The event will be held on Thursday, Oct. 12, 2017 at Robinson College, Cambridge, UK, with company tours and a networking reception on the day before during the 41th OE-A Working Group Meeting (Oct. 11, 2017).
 
Inspired by a keynote on machine learning by Christopher Williams, chief architect for IBM Watson Europe, attendees will learn more on IoT and its application in smart packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.
 
Professor Sir Richard Friend, FRS, FREng, will be the dinner speaker at the networking reception on Oct. 11. Furthermore, presentations by experts from international companies and research institutes such as PragmatIC, Arjowiggins, VTT and CDT will be offered. The finalized program will be available soon.
 
Registration will be handled via EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge. OE-A members will receive a discount of 60% on ticket prices. For questions, contact daria.firlus@oe-a.org

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